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MMG3004N User Reference Manual Guide - NXP

Manufacturer:

NXP

Case Package:

HQFN-16

Description:

InGaP HBT GPA, 400-2200MHz, 17dB, 27 dBm

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Pages guide:

Package Footprint Pad Layout onP2P7P8

Soldering Temperature onP2

View Datasheet

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MMG3004N Documents

MMG3004N User Reference Manual Guide

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9 Pages / 0.63 MByte

MMG3004N Other Datasheet PDF

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5 Pages / 0.17 MByte

MMG3004N Application Note

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21 Pages / 0.44 MByte

MMG3004N Packaging

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3 Pages / 0.05 MByte

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MMG3004N Datasheet PDF

NXP

InGaP HBT GPA, 400-2200MHz, 17dB, 27 dBm

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