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W987D6HBGX6E TR Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

TFBGA-54

Description:

DRAM Chip Mobile LPSDR SDRAM 128Mbit 8Mx16 1.8V 54Pin VFBGA

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W987D6HBGX6E TR Datasheet PDF (68 Pages)

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W987D6HBGX6E TR Specifications

TYPE

DESCRIPTION

Number of Pins

54 Pin

Case/Package

TFBGA-54

Number of Bits

16 Bit

Access Time(Max)

6ns, 5.4ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-25 ℃

Supply Voltage

1.7V ~ 1.95V

W987D6HBGX6E TR Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Not For New Designs

Packaging

Tape & Reel (TR)

Size-Height

0.66 mm

Operating Temperature

-25℃ ~ 85℃

W987D6HBGX6E TR Environmental

W987D6HBGX6E TR Function Overview

W987D6HBGX6E TR Documents

W987D6HBGX6E TR Features Description Parametrics

Winbond Electronics

68 Pages / 1.43 MByte

W987D6HBGX6 Documents

W987D6HBGX6E Datasheet PDF

Winbond Electronics

DRAM Chip Mobile LPSDR SDRAM 128Mbit 8Mx16 1.8V 54Pin VFBGA

W987D6HBGX6I Datasheet PDF

Winbond Electronics

Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 9MM, 0.8MM PITCH, HALOGEN AND LEAD FREE, VFBGA-54

W987D6HBGX6E TR Datasheet PDF

Winbond Electronics

DRAM Chip Mobile LPSDR SDRAM 128Mbit 8Mx16 1.8V 54Pin VFBGA

W987D6HBGX6I TR Datasheet PDF

Winbond Electronics

DRAM Chip Mobile LPSDR SDRAM 128Mbit 8Mx16 1.8V 54Pin VFBGA

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