●Features
●• Stacked device (two 256Mb die)
●• SPI-compatible serial bus interface
●• Double transfer rate (DTR) mode
●• 2.7–3.6V single supply voltage
●• 108 MHz (MAX) clock frequency supported for all protocols in single transfer rate (STR) mode
●• 54 MHz (MAX) clock frequency supported for all protocols in DTR mode
●• Dual/quad I/O instruction provides increased throughput up to 54 MB/s
●• Supported protocols
● – Extended SPI, dual I/O, and quad I/O
● – DTR mode supported on all
●• Execute-in-place (XIP) mode for all three protocols
● – Configurable via volatile or nonvolatile registers
● – Enables memory to work in XIP mode directly after power-on
●• PROGRAM/ERASE SUSPEND operations
●• Available protocols
● – Available READ operations
● – Quad or dual output fast read
● – Quad or dual I/O fast read
●• Flexible to fit application
● – Configurable number of dummy cycles
● – Output buffer configurable
●• Software reset
●• Additional reset pin for selected part numbers 1
●• 3-byte and 4-byte addressability mode supported
●• 64-byte, user-lockable, one-time programmable (OTP) dedicated area
●• Erase capability
● – Subsector erase 4KB uniform granularity blocks
● – Sector erase 64KB uniform granularity blocks
● – Single die erase
●• Write protection
● – Software write protection applicable to every 64KB sector via volatile lock bit
● – Hardware write protection: protected area size defined by five nonvolatile bits (BP0, BP1, BP2,BP3, and TB)
● – Additional smart protections, available upon request
●• Electronic signature
●– JEDEC-standard 2-byte signature (BA20h)
●– Unique ID code (UID): 17 read-only bytes, including: Two additional extended device ID bytes to identify device factory options; and customized factory data (14 bytes)
●• Minimum 100,000 ERASE cycles per sector
●• More than 20 years data retention
●• Packages – JEDEC-standard, all RoHS-compliant
●– V-PDFN-8/8mm x 6mm (also known as SON, DFPN, MLP, MLF)
●– SOP2-16/300mils (also known as SO16W, SO16-Wide, SOIC-16)
●– T-PBGA-24b05/6mm x 8mm (also known as TBGA24)
Part 3D Model
