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Part Datasheet Search > RF diodes > NXP > BAP65-02,115 Datasheet PDF
BAP65-02,115
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BAP65-02,115 Datasheet PDF (4 Pages)
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BAP65-02,115 Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
2 Pin
Capacitance
0.9 pF
Case/Package
SOD-523
Forward Voltage
0.9 V
Power Dissipation
715 mW
Forward Current
100 mA
Reverse Breakdown Voltage
30 V
Forward Current (Max)
100 mA
Operating Temperature (Max)
150 ℃
Operating Temperature (Min)
-40 ℃
Power Dissipation (Max)
715 mW
Voltage Rating
30 V

BAP65-02,115 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Cut Tape (CT)
Size-Length
1.25 mm
Size-Width
1.65 mm
Size-Height
0.65 mm
Operating Temperature
-65℃ ~ 150℃ (TJ)

BAP65-02,115 Documents

NXP
4 Pages / 0.05 MByte
NXP
19 Pages / 0.14 MByte
NXP
3 Pages / 0.21 MByte
NXP
1 Pages / 0.12 MByte
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