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BAP50-04,215 Datasheet PDF - NXP

Manufacturer:

NXP

Category:

RF diodes

Case Package:

SOT-23-3

Description:

DIODE PIN GP 50V 50mA SOT-23

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

BAP50-04,215 Datasheet (9 Pages)

Pinout Diagram on1 PageHot

Package Outline Dimension on4 Page

Part Numbering System on1 Page

BAP50-04,215 Datasheet PDF (9 Pages)

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BAP50-04,215 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Case/Package

SOT-23-3

Forward Voltage

1.1 V

Power Dissipation

250 mW

Forward Current

50 mA

Forward Current (Max)

50 mA

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

65 ℃

Power Dissipation (Max)

250 mW

Voltage Rating

50 V

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BAP50-04,215 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Size-Length

3 mm

Size-Width

1.4 mm

Size-Height

1 mm

Operating Temperature

-65℃ ~ 150℃ (TJ)

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BAP50-04,215 Environmental

BAP50-04,215 Function Overview

BAP50-04,215 Documents

BAP50-04,215 Datasheet

NXP

9 Pages / 0.14 MByte

BAP50-04,215 Other Datasheet PDF

NXP

9 Pages / 0.05 MByte

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