75003-0105 Datasheet PDF - Molex

●HD Mezz™

●Simplify PCB routing, maximize card-slot space and achieve speeds up to 12.5 Gbps with Molex"s HD Mezz; designed for the large and growing high-density and high-performance mezzanine connector market. The High Density Mezzanine (HD Mezz) board-to-board connector is designed for computer, networking, telecommunications, storage and general market applications with high pin-count devices on mezzanine or module printed circuit boards (PCBs). This design provides a flexible tooling approach that allows for multiple stack heights and circuit-size extensions.

●HD Mezz provides many benefits. It allows customers to simplify PCB routing without sacrificing performance, avoid the expense of large complex multi-layer boards and utilize space more efficiently within a given card slot area. Option cards may be added or upgraded to increase flexibility in design, production and testing.

●The HD Mezz design has superior electrical and mechanical features that are cost competitive. The Molex patented solder-charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products.