74060-2504 Datasheet PDF - Molex

●VHDM® Backplane Connectors and Cable Assemblies

●Achieve high-speed signal integrity via Molex’s VHDM ® backplane connector and cable assembly system through high-density and high-speed performance utilizing the differential pair architecture ideal for datacom, telecom, testing and military applications. VHDM connectors and cable assemblies are available in 6- and 8-row configurations supporting data rates of 3.125 Gbps with less than 5% crosstalk. Individual wafers incorporate the signal pins and stripline shielding to allow 100% of the signal pins to be used for signal transmission. The grid of the mating face is 2.00mm between columns and 2.25mm between rows.

●The daughter card connectors are made from wafers. Each wafer has a column of signal contacts plus a ground shield, which are then mounted onto a stiffener to make a mono-block connector. Backplane headers are available in lengths of 10 and 25 columns; open and guide pin versions are available. Optional freestanding guide pins are available. These robust guide pins mount directly into the backplane PCB to accommodate heavier daughtercards.

●Cable assembly designs accommodate multi-wafer and custom back-shell solutions. In-house test equipment can verify design goals through Time Domain Reflectrometry (TDR) and impedance profile analysis.