Part 3D Model

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72T3645L4-4BBG Datasheet PDF - Integrated Device Technology

Manufacturer:

Integrated Device Technology

Category:

FIFOs

Case Package:

BGA-208

Description:

1K x 36 TeraSync FIFO, 2.5V

Pictures:

3D Model

Symbol

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Pinout

Product Pictures

Documentation:

72T3645L4-4BBG Datasheet (57 Pages)

Pinout Diagram on2 Page 3 Page 7 Page 8 Page 9 PageHot

72T3645L4-4BBG Datasheet PDF (57 Pages)

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72T3645L4-4BBG Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

208 Pin

Case/Package

BGA-208

Access Time

8ns, 3.4ns

Supply Voltage

2.375V ~ 2.625V

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72T3645L4-4BBG Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Obsolete

Packaging

Tray

Size-Length

17.0 mm

Size-Width

17.0 mm

Operating Temperature

0℃ ~ 70℃

Size-Thickness

1.76 mm

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72T3645L4-4BBG Environmental

72T3645L4-4BBG Documents

72T3645L4-4BBG Datasheet

Integrated Device Technology

57 Pages / 0.46 MByte

72T3645L44 Documents

72T3645L4-4BBG Datasheet PDF

Integrated Device Technology

1K x 36 TeraSync FIFO, 2.5V

72T3645L4-4BB Datasheet PDF

Integrated Device Technology

FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 1K x 36 208Pin BGA

72T3645L4-4BB Datasheet PDF

Renesas Electronics

IC FIFO 1024X36 4-4NS 208-BGA

72T3645L4-4BBG Datasheet PDF

Renesas Electronics

IC FIFO 1024X36 4-4NS 208-BGA

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