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Part Datasheet Search > Memory Chip > Integrated Device Technology > 71T75602S166BGGI Datasheet PDF
71T75602S166BGGI
$ 30.004
71T75602S166BGGI Datasheet PDF (23 Pages)
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71T75602S166BGGI Specifications

TYPE
DESCRIPTION
Number of Pins
119 Pin
Case/Package
BGA-119
Operating Temperature (Max)
85 ℃
Operating Temperature (Min)
-40 ℃
Supply Voltage
2.375V ~ 2.625V

71T75602S166BGGI Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tray
Size-Length
14.0 mm
Size-Width
22.0 mm
Size-Height
1.55 mm
Operating Temperature
-40℃ ~ 85℃ (TA)
Size-Thickness
2.15 mm

71T75602S166BGGI Documents

Integrated Device Technology
23 Pages / 1.25 MByte
Integrated Device Technology
23 Pages / 0.39 MByte

71T75602S166 Documents

Integrated Device Technology
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Integrated Device Technology
SRAM Chip Sync Single 2.5V 18M-Bit 512K x 36 3.5ns 119Pin BGA Tray
Integrated Device Technology
SRAM Chip Sync Single 2.5V 18M-bit 512K x 36 3.5ns 119Pin BGA Tray
Integrated Device Technology
ZBT SRAM, 512KX36, 3.5ns, CMOS, PQFP100, 14 X 20MM, 1.4MM HEIGHT, GREEN, PLASTIC, MO-136DJ, TQFP-100
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IC SRAM 18Mbit 166MHz 119BGA
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IC SRAM 18Mbit 166MHz 100TQFP
Integrated Device Technology
SRAM Chip Sync Single 2.5V 18M-bit 512K x 36 3.5ns 119Pin BGA Tray
Integrated Device Technology
IC SRAM 18Mbit 166MHz 119BGA
Integrated Device Technology
IC SRAM 18Mbit 166MHz 119BGA
Renesas Electronics
IC SRAM 18M PARALLEL 100TQFP
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