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658-45ABT3 Datasheet PDF - Wakefield Engineering

Manufacturer:

Wakefield Engineering

Category:

Heatsinks

Case Package:

BGA

Description:

Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

658-45ABT3 Datasheet (1 Pages)658-45ABT3 User Reference Manual Guide (1 Pages)

658-45ABT3 Datasheet PDF (1 Pages)

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658-45ABT3 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Case/Package

BGA

Power Dissipation

3 W

Thermal Resistance

6 ℃/W

Thermal Resistance @ Forced Air Flow

6.00℃/W @200LFM

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658-45ABT3 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Bulk

Color

Black

Material

Aluminum

Size-Length

27.94 mm

Size-Width

27.9 mm

Size-Height

11.4 mm

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658-45ABT3 Environmental

658-45ABT3 Export Classifications

658-45ABT3 Function Overview

658-45ABT3 Documents

658-45ABT3 Datasheet

Wakefield Engineering

1 Pages / 0.09 MByte

658-45ABT3 User Reference Manual Guide

Wakefield Engineering

1 Pages / 0.07 MByte

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